Samsung releases latest process roadmap || Samsung's new Developments


Samsung releases latest process roadmap


Recently, Samsung Electronics held the Samsung Foundry Forum (SFF) at its Device Solutions USA headquarters in San Jose, California, and announced its latest foundry technology roadmap and achievements.



Here are the main highlights:

New nodes and technology progress: Samsung announced two new cutting-edge nodes - SF2Z and SF4U. SF2Z is a 2nm process that uses backside power delivery network (BSPDN) technology, which places the power rail on the back of the wafer to improve power, performance and area (PPA) and reduce voltage drop (IR drop), mainly for high-performance computing and artificial intelligence applications. SF4U is a variant of the 4nm process that provides PPA improvements by combining optical shrink technology.

Surpassing TSMC: Samsung plans to launch the SF2 node (formerly known as SF3P), a 2nm process technology mainly targeted at high-performance computing and smartphone applications, in 2025. This puts Samsung officially ahead of TSMC in the 2nm node, which plans to start manufacturing chips using the N2 process at the end of 2025.



Maturity and application of GAA process: Samsung emphasized the maturity of its all-around gate (GAA) process technology, which has entered its third year of mass production. The company plans to mass produce the second-generation 3nm process (SF3) in the second half of this year and plans to adopt GAA on the upcoming 2nm process. Samsung said that its GAA production has been growing steadily since 2022 and is expected to grow significantly in the next few years.

AI Solution Platform: Samsung also released the AI Solution artificial intelligence platform, which provides high-performance, low-power, and high-bandwidth solutions for specific customers' AI needs, and plans to launch a one-stop AI solution with integrated CPO in 2027.

Market and Business Growth: Samsung Foundry’s AI sales grew 80% over the past year, demonstrating its ability to meet changing demands in the market.

These developments demonstrate Samsung's innovative and competitive capabilities in chip manufacturing technology, especially in the fields of high-performance computing and artificial intelligence. Samsung's moves are aimed at consolidating its leading position in the semiconductor industry and competing more fiercely with its main rival TSMC in the coming years. (Comprehensive report)


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